CONGRATULATIONS! SPONSOR INFINEON TECHNOLOGIES KULIM SDN. BHD.

ASSOC. PROF. DR. MASRINA BINTI MOHD NADZIR 

This project focuses on electrochemical research in semiconductor processes, encompassing electrolytic plating, electroless plating, electromigration, and corrosion involving critical metallic elements such as Cu, Ni, Pd, Au, and W. The work aims to establish a comprehensive baseline for electrochemical processes, including both kinetics and dynamics, applied to wide bandgap materials, silicon, metals, and insulators. This involves developing metal plating process and material characterization methods to evaluate plated material properties and identify factors contributing to defects such as corrosion and electromigration. Analytical techniques will be employed to correlate process parameters with defect formation mechanisms, enabling the interpretation and proposal of possible underlying mechanisms.

PROF. DR. LOW SIEW CHUN

This project focuses on electrochemical research in semiconductor processes, encompassing electrolytic plating, electroless plating, electromigration, and corrosion involving critical metallic elements such as Cu, Ni, Pd, Au, and W. The work aims to establish a comprehensive baseline for electrochemical processes, including both kinetics and dynamics, applied to wide bandgap materials, silicon, metals, and insulators. This involves developing metal plating process and material characterization methods to evaluate plated material properties and identify factors contributing to defects such as corrosion and electromigration. Analytical techniques will be employed to correlate process parameters with defect formation mechanisms, enabling the interpretation and proposal of possible underlying mechanisms.

PROF. DR. LIM JIT KANG

This study employs computational fluid dynamics (CFD) to investigate an electrochemistry-driven reaction within a complex turbulent flow system subjected to multidirectional mixing in a heat-controlled environment. The simulation domain couples three key physical processes: reaction kinetics of the electroless plating chemistry, heat transfer regulating temperature-sensitive reaction rates, and fluid dynamics governing reactant distribution. Turbulence modelling captures mixing-induced mass transport, while heat control is integrated to maintain optimal plating conditions. The model provides insight into spatial-temporal variations of temperature, flow patterns, and deposition rates, offering a predictive framework for process optimization in industrial-scale electroless plating applications.